About Our Teardowns
ABI Research's Teardowns uncover innovative design features and new semiconductor components to guide enterprises toward more streamlined solutions in future designs. We provide clients unmatched intelligence into phones, tablets, wearables, smart home devices, and components. Teardown reports include pinpoint power measurements, detailed parts lists, block diagrams, x-rays, and high-resolutions photos. Each step of the teardown process is carefully documented by our experts to present detailed insights into component parts and costs, as well as chip system functionality. And, our web-based format allows our clients to access immediate updates of our Teardowns, as our analysis progresses.
Recently Torn Down Devices
Our device teardowns cover more than 3,500 teardowns of mobile phones of all tiers, including smartphones, feature phones, and kid phones, as well as tablets, including iPads, the Samsung Galaxy, and the Microsoft Surface. Our device coverage also includes access to hundreds of wearable teardowns, including activity trackers, smart watches, kid trackers, VR devices, and high-tech jewelry. Smart Home teardowns include all things that make the home smart: smart thermostats, smart lighting, smart switches, surveillance cameras, smart smoke detectors, home automation hubs, and security devices. Clients have immediate access to new teardowns and updates, as our analysis progresses on high profile devices, devices with any new technology or chipset, and top-selling phones.
July 2, 2018 In Progress LG Electronics G7 ThinQ
July 2, 2018 In Progress OPPO F7
June 25, 2018 In Progress Xiaomi Tech Mi Sphere Camera
June 25, 2018 In Progress Huawei P20 Pro
June 25, 2018 In Progress Samsung Galaxy A6 (2018)
June 25, 2018 In Progress OnePlus 6
June 18, 2018 In Progress Asus ZenFone 5
June 18, 2018 In Progress Apple iPad (Gen6) Wi-Fi
June 18, 2018 In Progress Amazon Cloud Cam
June 11, 2018
Recently Torn Down Parts
Our Teardown coverage includes both electronic devices and components. Our experts carefully document each step of the teardown process to present detailed insights into component parts and costs, as well as chip system functionality. Detailed power measurements are available for nearly every operating mode, and our measurement techniques mean that specific IC current drains can be detected.
Recent Teardown Notes
Get the latest key findings — as we uncover them — during the Teardown process.